Hi Hesse,
I don't have any names but I intend to interest some of our suppliers.
The % is the eutectic of 42Sn58Bi or 41Sn58Bi + 2Ag.
The melting temp is 138deg C. The HASL process should be easier than the
63Sn/37Pb alloy.
You should calculate the final solder joint, after the applying of solder
paste / wave soldering / hand soldering and the components leads plating.
I think the Bi final pollution / concentration will be less than 4%.
Any comment from the forum?
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Best Regards
Reuven ROKAH
e mail: [log in to unmask]
"Hesse, Jack"
<Jack.Hesse@ To: "[log in to unmask]" <[log in to unmask]>
sciatl.com> cc:
Subject: RE: [LF] HASL Tin / Bi
27/07/2005 16:45
Reuven,
What % of Bi is being used with the HASL alloy? Do you know the names of
any board suppliers using this alloy? The only consern would be using
these boards with the current SnPb solder paste if the Bi concentration in
the board is significant; above 4%.
Best Regards,
Jack Hesse
DFx Engineering
Scientific Atlanta
Phone: 770.236.3085
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Reuven ROKAH
Sent: Wednesday, July 27, 2005 9:34 AM
To: [log in to unmask]
Subject: [LF] HASL Tin / Bi
Hi All,
I recommend to check the option of HASL PCBs with the Tin Bismuth alloy.
Its have low melting temp. and both metals work fine together.
HASL coating is good option for SMT PCBs up to 20 mils pitch.
Any objections?
Best Regards
Reuven ROKAH
e mail: [log in to unmask]
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