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September 2006

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Subject:
From:
Lester Subrattee <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 1 Sep 2006 11:22:33 -0400
Content-Type:
text/plain
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text/plain (104 lines)
"7. Lead in high melting temperature type solders (i.e. lead based solder
alloys containing more than 85 % lead)"

This exemption is in the amendments to the RoHS annex and in the original
Annex (was "Tin-lead based" originally).

Also in the amendments are specific exemptions for microprocessors and Flip
Chips.

"14. Lead in solders consisting of more than two elements for the connection
between the pins and the package of
microprocessors with a lead content of more than 80 % and less than 85 % by
weight."

"15. Lead in solders to complete a viable electrical connection between
semiconductor die and carrier within integrated
circuit Flip Chip packages."

If the part/solder falls within any of the three categories it is exempt and
can be used in a product that is non-exempt.

Regards,
LS


-----Original Message-----
From: Kane, Amol (349) [mailto:[log in to unmask]]
Sent: Friday, September 01, 2006 11:00 AM
To: [log in to unmask]
Subject: Exemptions

Hi,=20
I am a little confused between RoHS part exemptions and application exempti=
ons. For e.g. a BGA component can be RoHS compliant even if the 1st level i=
nterconnects have high lead solder because there is a specific lead exempti=
on for this application....correct? now is there a document that says that =
high lead-solder can be used for 1st level interconnects ONLY for certain p=
art types (for e.g. BGAs and some others?) to be RoHS compliant, or it is i=
ndependent of the part type?

Can this BGA now be used in a non exempt application assembly and still not=
 violate the RoHS compliancy of that assembly?

We have a particular component (Not BGA) where a high Pb solder will have t=
o be used so that the 1st level interconnect will not melt when exposed to =
LF soldering temperatures during assembly. The final assembly is a non exem=
pt product.

Regards,

Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing, Inc.=20
941 Route 38  Owego, NY 13827
Phone: (607) 687-7669 x349
Fax: (607) 687-9733
[log in to unmask]
www.harvardgrp.com




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