Lead-free solder-- what a lose-lose proposition!!
To reflow all solder and activate flux you have to heat the board
to levels that damage the components and substrates.

Here's a better way:
http://www.pcb007.com/pages/zone.cgi?a=53298&artpg=1
Tell your CEO!

Harvey Miller




________________________________
From: "Iven, Jowan" <[log in to unmask]>
To: [log in to unmask]
Sent: Friday, October 2, 2009 3:28:59 AM
Subject: Re: [LF] leaded BGAs in lead free process?

Hello Peter,

You first have to understand/know  the impact of the lower profile.
Dit the solder melt on every spot on the board?
(What temperatures did the solderjoints reach)
Is the flux completely activated?

But you also ran a leaded bga through an "adjusted" (?) leadfree
process.
I would not trust the quality of the board.
The bga can be electrically damaged because of the higher temperatures
And concerning reliability on the long term: a mixed bga  solderjoint
has proven to be less reliable.


Jowan Iven 


-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Pete Houwen
Sent: Thursday, October 01, 2009 4:57 PM
To: [log in to unmask]
Subject: [LF] leaded BGAs in lead free process?

We have a proto board that has a low impedance short between VCC and GND

that we can't track down.  We just got an "oh by the way" that the .8mm
BGA 
was leaded, but the board was run lead free.  He said he ran the profile
lower 
to "help"

I'm trying to imagine what happens to the leaded balls under those
conditions, 
and could it have caused the problem?  My initial assumption is loose
solder 
under there, but we don't have quick access to x-ray.

I'm not real high on this assembly shop, so the next suspect is the LGA 
voltage converters.

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