Subject: | |
From: | |
Reply To: | |
Date: | Tue, 17 Mar 1998 15:20:01 -0600 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
IPC announces the availability of IPC-6015, Qualification and Performance
Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting
Structures.
This specification establishes the specific requirements for the organic mounting
structure used to interconnect chip components, which in combination form the
completed functional Organic Single-chip Module (SCM-L) or Organic Multichip Module
(MCM-L) assembly, and the quality and reliability assurance requirements that must be
met for their acquisition.
Chair: Kaz Hirasaka, Eastern Company Ltd.
$20 members / $40 nonmembers
It is available through the IPC:
phone- 847.509.9700
fax- 847.509.9819
email- [log in to unmask]
URL- www.ipc.org
################################################################
IPC_New_Releases E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE IPC_New_Releases <your full name>
To unsubscribe: SIGNOFF IPC_New_Releases
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################
|
|
|