Surface Mount Council
Status of the Technology Industry Activities and Action Plan 1998

This document is intended to provide the reader with a brief review and status of
electronic assembly industry, with a focus on key technical changes that have
occurred in the past year.  It does not replace the technical and marketing
information published by other organizations.  We hope this is a useful tool that
gives you a better understanding of a complex subject.

The document highlights several of the critical issues that the electronics industry
faced in implementing process intensive technologies, such as Surface Mount
Technology.  Several of the critical issues discussed in 1986 still exist today.

The Surface Mount Council adopted a Status and Action Plan in order to summarize,
clarify and identify the problem areas we all face in converting from through-hole
(TH) to surface mount (SM) and on to fine pitch (FP), ball grid array (BGA) and chip
mounting (CM) technologies.  121 pages.  Released August 1998.

IPC Member:  $40              Nonmember:  $40

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