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The following IPC product has now been released.  To place your order,
click on the link below, which will take you to the Online Store at
www.ipc.org/onlinestore for quick and easy purchasing. Or, contact IPC's
Customer Service Department at [log in to unmask]> Monday through Friday,
9:00 am - 5:00 pm CST or at 847-597-2862. 

 
New! SPVC2005-CD, Round Robin Testing and Analysis of Lead Free Solder
Pastes with Alloys of Tin, Silver and Copper at www.ipc.org/SPVCFR. 

Do you want to know which lead free solder is recommended for our
industry? Over the past three years, The IPC Solder Products Value
Council (SPVC) invested the equivalent of one million dollars in
volunteer time, equipment and supplies to come up with the answer. The
SPVC analyzed three key lead free alloys: 96.5/3.0/0.5
tin/silver/copper; 95.5/3.8/0.7 tin/silver/copper; and 95.5/4.0/0.5
tin/silver/copper and the end result of the research is found in this
report.

The report is a 50 page analysis and recommendation of a lead free
alloy. It also includes 18 appendices with nearly 60 megabytes of data
and research charts. Some appendices are formatted in Excel to ease
further analysis and data manipulation. 

The testing in the report and appendices includes DSC melt analysis;
wetting balance; area of spread; visual inspection of solder joints;
X-ray analysis of solder joint voids; temperature cycling testing;
thermal shock testing and metallurgical cross section. This data
supports the Council's recommendation of 96.5/3.0/0.5 tin/silver/copper
(SAC305) as the alloy of choice for lead free applications. The testing
program was not intended to compare the lead free alloys' performance
against tin lead. However, because tin lead was used as a control, the
study does provide some comparisons between the tin lead and lead free
alloy performance.

Report chapters cover: 

*  Assembly Performance Comparison 

*  Solder Paste Down Selection 

*  Results of Assembly of Test PCBs 

*  Metallographic Analysis and Baseline Characterization of Flextronics
Assemblies 

*  Metallographic Analysis and Baseline Characterization of Solectron
Assemblies 

*  Thermal Shock and Temperature Cycle Test Data 

Appendices include:
Appendix 1 Alloy Characterization
Appendix 2 Engent Down Select Data
Appendix 3 Assembly Parameter Summary
Appendix 4 Test Vehicle Description
Appendix 5 Assembly Process Data
Appendix 6 500 Cycles
Appendix 7 1000 Cycles
Appendix 8 1500 Cycles
Appendix 9 2000 Cycles
Appendix 10 2500 Cycles
Appendix 11 3000 Cycles
Appendix 12 3500 Cycles
Appendix 13 4000 Cycles
Appendix 14 4500 Cycles
Appendix 15 5000 Cycles
Appendix 16 6000 Cycles
Appendix 17 6000 Monitored Cycles
Appendix 18 Void Data

All files on this CD can be printed.  To place an order for any document
or for more information, go to www.ipc.org/onlinestore  or contact IPC
Customer Service at 847-597-2862. 

                                                   CD-ROM only

IPC Members:                                         $99.00

Nonmembers:                                         $199.00

 

 

 

 

 

 

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