New multimedia presentations released by IPC. Please click through the product codes to purchase and download the presentations.
MILMKT12-11-EMBCAP<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=5b4640ba-8e47-e111-95b1-00155d05286a>
Embedded Capacitor Technology; Status, Opportunity and Challenges
"Embedded Capacitor Technology; Status, Opportunity and Challenges" was presented by John Andresakis, vice president of strategic technology, Oak-Mitsui, at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, Washington D.C., in December 2011.The author explains how the use of this technology improves performance, reliability and assembly cost of printed boards and is RoHS compliant. It has been in use for more than seven years and has found application in commercial and some military products. This presentation includes the synchronized slides and audio. 23 minutes. Released 2012.
IPC Member Price $35.00
Standard Price $50.00
MILMKT12-11-FINFIN <https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=19fd6d68-0b42-e111-9c3d-00155d05e552>
Final Finish for Connectivity
"Final Finish for Connectivity" was presented by George Milad of Uyemura International Corporation at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, in December 2011. The author describes surface finishes applied to printed circuit boards to enhance their reliability, solderability, shelf life and the applicability to wire bonding. He also mentions the IPC standards where they apply to the materials. This presentation includes the synchronized slides and audio. 24 minutes. Released 2012.
IPC Member Price $35.00
Standard Price $50.00
MILMKT12-11-PWBTECHR <https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=be01b015-0842-e111-9c3d-00155d05e552>
PWB Technology Roadmap
"PWB Technology Roadmap" was presented by Lance Auer, product development engineering, Raytheon Missile Systems Division, at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in Washington D.C., in December 2011.The author explores the developing challenges of PCB design. Design types, digital, power and high speed RF circuits present conflicting requirements of more layers and laminations, thin vs. thick copper, materials and testability. As components become smaller and pin counts increase with decreased pin pitch, layout nightmares can result. Reliability, design rules and suppliers are all ongoing concerns. This presentation includes synchronized audio and video files. 27 minutes. Released 2012.
IPC Member Price $35.00
Standard Price $50.00
MILMKT12-11-RFPDOA<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=de41c853-0742-e111-9c3d-00155d05e552>
Is Your RFP D.O.A.
"Is Your RFP D.O. A." was presented at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in December 2011 by Steve DeWaters, president, Penumbra Strategies, Inc. The author describes the procedures of the military in preparing an RFP and evaluating the proposals. He also describes the procedures to create an effective response to the RFP and some of the pitfalls of incomplete or inadequate responses. This presentation includes the synchronized audio and visual files. 30 minutes. Released 2012.
IPC Member Price $35.00
Standard Price $50.00
MILMKT12-11-TECRDMP<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=43cfb16f-3c41-e111-9c3d-00155d05e552>
Technology Roadmap for Aerospace & Defense Electronics Assembly Industry
"Technology Roadmap for Aerospace & Defense Electronics Assembly Industry" was presented at the IPC Conference for the PCB Industry: Critical Issues for the Military Market by Bill Murphy, Fellow Product Integration, Lockheed Martin, at Washington D.C, in December 2011. The author describes present and future challenges to the electronics assembly industry. Budget decreases and requirements for quicker and more reliable products are impacting product development. Current challenge trends include circuit and power density and supply chain. Future challenges include embedded actives, passives and optical wave guides.30 minutes. Released 2012.
IPC Member Price $35.00
Standard Price $50.00
Kimberly Sterling, CAE
Vice President, Marketing and Communications
IPC - Association Connecting Electronics Industries
3000 Lakeside Drive
Suite 309 S
Bannockburn, IL 60015-1249 USA
+1 847-597-2805 tel
+1 847-615-5605 fax
[log in to unmask]
www.ipc.org
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