J-STD-033C<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=2b9139e8-6b4e-e111-95b1-00155d05286a>
Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitive Components
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC. 18 pages. Released February 2012.
IPC Member Price $31.00
Nonmember Price $62.00
9704A<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=4fe5aec8-8f4e-e111-95b1-00155d05286a>
Printed Circuit Assembly Strain Gage Test Guideline
Strain gage testing allows for objective analysis of the strain and strain rate levels to which a surface mount package may be subjected to during assembly, test and operation. Excessive strain can result in various failure modes for different solder alloys, package types, surface finishes or laminate materials. This document describes specific guidelines for strain gage testing during the printed board manufacturing process, including board assembly, test, system integration and other types of operations that may induce board flexure. This document also provides coverage of test setup and equipment requirements, strain measurement techniques and test report formats. Revision A contains 22 full-color photographs and illustrations depicting instrumented boards and gage placement and has been updated to address lead-free assembly technology. 25 pages. Released February 2012.
IPC Member Price $36.00
Nonmember Price $72.00
To see additional formats and pricing, please click through the links above.
IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing [log in to unmask]<mailto:[log in to unmask]> within 90 days. The file is enabled to print one copy of the standard. You will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.
Learn more about new options for new releases announcements for all documents, English documents only, European languages only or Asian languages only.<http://www.ipc.org/ContentPage.aspx?pageid=E-mail-Forums>
Kimberly Sterling, CAE
Vice President, Marketing and Communications
IPC - Association Connecting Electronics Industries
3000 Lakeside Drive
Suite 309 S
Bannockburn, IL 60015-1249 USA
+1 847-597-2805 tel
+1 847-615-5605 fax
[log in to unmask]<mailto:[log in to unmask]>
www.ipc.org<http://www.ipc.org>
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