IPC/JPCA-6801
Terms and Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards

According to the 1998 World Market Report for Printed Wiring Boards and Substrate Materials released by the TMRC, Japan is the world leader in the production of microvia substrates, accounting for almost 88% of the world market.  Recognizing this, the IPC HDI Committee chose to adopt JPCA-BU01 as IPC/JPCA-6801.  The adoption of this document is a second step in the ongoing efforts of the IPC HDI Committee and JPCA Build-Up Committee to ensure global consistency in the understanding of terminologies, requirements and test methods for HDI and microvia applications.

IPC/JPCA-6801 lists terms specific to HDI and test methods for CTE for materials and HDI PWBs, peel strength and thermal shock.  Also included is a design criteria table and background information for the development of a standard for HDI PWBs.  44 pages.  Released January 2000.

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