The following IPC product has now been released.  To place your order, click on the link below, which will take you to the Online Store at www.ipc.org/onlinestore for quick and easy purchasing. Or, contact IPC's Customer Service Department at [log in to unmask]> Monday through Friday, 9:00 am – 5:00 pm CST or at 847-597-2862. 



 

New! SPVC2005-CD, Round Robin Testing and Analysis of Lead Free Solder Pastes with Alloys of Tin, Silver and Copper at www.ipc.org/SPVCFR. 



Do you want to know which lead free solder is recommended for our industry? Over the past three years, The IPC Solder Products Value Council (SPVC) invested the equivalent of one million dollars in volunteer time, equipment and supplies to come up with the answer. The SPVC analyzed three key lead free alloys: 96.5/3.0/0.5 tin/silver/copper; 95.5/3.8/0.7 tin/silver/copper; and 95.5/4.0/0.5 tin/silver/copper and the end result of the research is found in this report.



The report is a 50 page analysis and recommendation of a lead free alloy. It also includes 18 appendices with nearly 60 megabytes of data and research charts. Some appendices are formatted in Excel to ease further analysis and data manipulation. 



The testing in the report and appendices includes DSC melt analysis; wetting balance; area of spread; visual inspection of solder joints; X-ray analysis of solder joint voids; temperature cycling testing; thermal shock testing and metallurgical cross section. This data supports the Council's recommendation of 96.5/3.0/0.5 tin/silver/copper (SAC305) as the alloy of choice for lead free applications. The testing program was not intended to compare the lead free alloys' performance against tin lead. However, because tin lead was used as a control, the study does provide some comparisons between the tin lead and lead free alloy performance.



Report chapters cover: 



  Assembly Performance Comparison 



  Solder Paste Down Selection 



  Results of Assembly of Test PCBs 



  Metallographic Analysis and Baseline Characterization of Flextronics Assemblies 



  Metallographic Analysis and Baseline Characterization of Solectron Assemblies 



  Thermal Shock and Temperature Cycle Test Data 



Appendices include:

Appendix 1 Alloy Characterization

Appendix 2 Engent Down Select Data

Appendix 3 Assembly Parameter Summary

Appendix 4 Test Vehicle Description

Appendix 5 Assembly Process Data

Appendix 6 500 Cycles

Appendix 7 1000 Cycles

Appendix 8 1500 Cycles

Appendix 9 2000 Cycles

Appendix 10 2500 Cycles

Appendix 11 3000 Cycles

Appendix 12 3500 Cycles

Appendix 13 4000 Cycles

Appendix 14 4500 Cycles

Appendix 15 5000 Cycles

Appendix 16 6000 Cycles

Appendix 17 6000 Monitored Cycles

Appendix 18 Void Data



All files on this CD can be printed.  To place an order for any document or for more information, go to www.ipc.org/onlinestore  or contact IPC Customer Service at 847-597-2862. 



                                                   CD-ROM only



IPC Members:                                         $199.00



Nonmembers:                                         $  99.00