TW0412-ENVIRON<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=78375424-e1a4-e111-ba2c-00155d05286a>
Tin Whisker Inorganic Coatings Evaluation (TWICE)
This multimedia presentation was given at the IPC Tin Whisker Conference, April 2012, by David Hillman, metallurgical engineer in the Advanced Operations Engineering Department of Rockwell Collins. The author describes a program funded by the Strategic Environmental Research and Development Program (SERDP) to evaluate various conformal coatings to mitigate tin whisker growth. He also introduces an inorganic coating, Alkali Silicate Glass (ASG). He subjects the coatings to temperature/humidity and thermal cycling to evaluate their applicability to long life, high reliability products. He explains the goals of coatings and questions what they can do beyond just capturing and containing whiskers.
This presentation includes the synchronized slides and audio from the original presentation. 22 minutes. Released 2012.
IPC Member Price $35.00
Nonmember Price $50.00
TW0412-MAGMORPH<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=bba6041f-dea4-e111-ba2c-00155d05286a>
Y-12 Lead-Free Solder Technologies
This paper was presented at the IPC Tin Whiskers Conference, April 2012, by Russell Hallman, senior engineer at Y-12 National Security Complex. The author examines the properties of non-magnetic material in magnetic fields as applied to solders and plating and possible effects on tin whisker growth. He shows that control of microstructure can control performance of surface wetting and crystal growth by distribution of chemistry in the mechanical joint. He then describes some areas for future study and expected benefits.
This presentation includes the synchronized slides and audio from the original presentation. 31 minutes. Released 2012.
IPC Member Price $35.00
Nonmember Price $50.00
TW0412-STATELEAD<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=3059c092-e7a4-e111-ba2c-00155d05286a>
Welcome and Introduction: the State of Lead-Free Address
This paper was presented at the IPC Tin Whiskers Coference, April 2012, by Linda Woody, engineering manager, Lockheed Martin Missiles and Fire Control. The author explores the present state of lead-free requirements for DoD high reliability, very long life, extended temperature range and high reliability products. Even though military electronics have exemption from RoHS and WEEE requirements, increasingly more COTS do comply presenting metalurgical problems. For these systems, mitigation does not mean elimination of tin whiskers. The future of lead-free and research gaps are also explored.
This presentation includes the synchronized slides and audio from the original presentation. 45 minutes. Released 2012.
IPC Member Price $35.00
Nonmember Price $50.00
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