IPC/EIA J-STD-026
Semiconductor Design Standard for Flip Chip Applications

This new standard addresses semiconductor flip chip design requirements.  Provides
information intended for applications utilizing standard semiconductor substrates,
materials, assembly and test methods commensurate with established fabrication,
bumping, test and handling practices.  Covered in the standard are electrical,
thermal and mechanical chip design parameters and methodologies, as well as the
reliability aspects associated with these conditions and processes.  The information
applies to all new designs as well as modifications of non-flip chip designs.  48
pages.  Released August 1999.


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