From my viewpoint for an internal cap, a thickness or void criteria would not be applicable.

Mike Hill

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Monarchio, James
Sent: Wednesday, February 09, 2011 5:10 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] buried cap thickness

Also the fill material may be the resin from lamination, I which case
the via could not be cap plated internally.

Jim

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A
Rios
Sent: Wednesday, February 09, 2011 4:57 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] buried cap thickness

unless the design specifically calls out buried caps, we tend to not cap

plate internals.

a generic note like what you cite below "fill, planarize, cap" we tend
to
only apply it to externals.

Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896



Chris Mahanna <[log in to unmask]>
Sent by: IPC-600-6012 <[log in to unmask]>
02/09/2011 04:38 PM
Please respond to
"(Combined Forum of D-33a and 7-31a Subcommittees)"
<[log in to unmask]>


To
[log in to unmask]
cc

Subject
[IPC-600-6012] buried cap thickness






I assume that we purposely did not include a caveat for buried cap
thickness in 6012C?

My particular interest is the case where the design predates 6012C and
gives no more specifics than: "fill, planarize and cap"

Thanks
Chris

Chris Mahanna
President, Technical Manager
Robisan Laboratory Inc.
6502 E. 21st Street
Indianapolis, Indiana 46219
317-353-6249


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