Greetings to All
John Perry is going to try and get the photo to you all since the forum
stripped it off the email.

I am going to suggest that while we are thinking of the best way to address
the words that will go into the various specifications - consider using a
similar format as we use for hole wall plating voids.

In that para we have words that further limit the acceptability of a plating
void - such as "when present at the interface of an inner layer and
prepreg".

It could be that we could use words to draw the line, but include words that
say "dielectric spacing must be maintained between ground or power plane
clearances and between layers".

Susan