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| From: | |
| Reply To: | (Combined Forum of D-33a and 7-31a Subcommittees) |
| Date: | Wed, 2 Jun 2010 18:16:32 -0400 |
| Content-Type: | text/plain |
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Hey Joey.
There is a long answer but-
2.6.8 intent is RMA. You want to get a solder column into the through holes to transfer an appropriate amount of heat to the thermal zone. No through holes?- You're just controlling the thermal impedance at the surface.
(I believe that I'm still allowed to say RMA without Hillman lopping off part of my tongue; steam aging... that's a different story.)
003 intent is standardized flux activity.
The only place I know to get the standardized flux in small quantities (shipped in the States) is the Brothers O'Brien. Contact info below.
Flux 1 is for SnPb tests, flux 2 is for Pb-free. Flux 2 was developed because it needed to be active longer for SAC305(003 alloy of choice)/Alt finishes.
Have a good one,
Chris
John O'Brien
Exec VP
S T and S Group
Ph: 859-353-5914 Cell 1-631-245-0574
E-mail: [log in to unmask]
Website: www.standsgroup.com
Blair Park, Rosedale Ave. Richmond KY 40475
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A Rios
Sent: Wednesday, June 02, 2010 3:17 PM
To: [log in to unmask]
Subject: [IPC-600-6012] flux for thermal stress and solderability testing
do ROL0 fluxes meet the requirements for thermal stress testing per
ipc-tm-650 2.6.8 AND J-STD-003B, paragraph 3.2.2 ??
the 2.6.8 method calls for ROL1 flux to be used per J-STD-004.
J-STD-003B, requires 'rosin flux #1' per para. 3.2.2 and has specific
analyticals called out; not disclosed in MSDS's nor technical datasheets
for flux materials.
from reviewing J-STD-004 it appears ROL0 exceeds the requirements of ROL1,
but then again, maybe the methods are seeking out specifically the use or
ROL1 no matter what.
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896
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