I'm with all of you on this.  We have more and more designs pushing the copper to edge rules and it takes many hours of negotiation at the end disposition.

Wendi


-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Monarchio, James
Sent: Thursday, December 15, 2011 9:50 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] haloing

Joey - this can be a point of contention especially if the customer
doesn't want the boards for some reason. We try to find this at Pre-Prod
Eng before we start the build. Most time we miss it and argue that this
is not applicable in this area since the metal is designed to the edge
of the board.

We discussed this during the rev C meetings - I think this should be
clarified better in the spec and my opinion is that if conductor to edge
spacing does not meeting the guidelines of 2221 then the haloing
criteria should be AABUS. As the distance to the edge of the board gets
less, 3.3.1 becomes meaningless.

Jim

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A
Rios
Sent: Thursday, December 15, 2011 12:09 AM
To: [log in to unmask]
Subject: [IPC-600-6012] haloing

wondering how others interpret the applicability of 6012c 3.3.1 (and its

6018 equivalent) with respect to haloing, for designs that have metal to

the edge of a pwb, as shown below?? conductor to conductor spacing is
highly compliant, distance from the solder feature to the first halo
along
the edge is less than 4 mils.


to me 3.3.1 has a context where metal is away from the board edge by
design, unlike the attached image.....

Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896

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