IPC-600-6012 Archives

December 2011

IPC-600-6012@IPC.ORG

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Subject:
From:
Denise Chevalier <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Mon, 5 Dec 2011 12:50:41 -0500
Content-Type:
text/plain
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text/plain (78 lines)
Could it be a peel able mask - used on selective coatings

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Mike Hill
Sent: Monday, December 05, 2011 10:21 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Solder mask cure on SMDs

Chris,

Usually gummy is tape adhesive not mask.   It might even have blue tent
from the mask.

Are you sure it's mask?

Mike Hill

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Chris
Mahanna
Sent: Monday, December 05, 2011 9:29 AM
To: [log in to unmask]
Subject: [IPC-600-6012] Solder mask cure on SMDs

Hello all,
A customer has 1.0mm BGA SMD lands with gummy mask and ~0.4%
solderability skips when edge dip tested.
By skip, I mean all surrounding lands solder beautifully, while the
subject land takes no solder at all.
By gummy, I mean that pushing with hypodermic needle yields piled-up
mask, not chipping mask.  Away from the SMD area, we get chipping mask.

Finish is ENIG, mask is BLUE.

I'm looking for comments on root cause, and maybe how to cost
effectively collect more evidence.

We've got bitten by the uncertainty of FTIR testing before.
Differential solubility in mask stripper?

Thanks a million,
Chris

Chris Mahanna
Robisan Laboratory Inc.
317-353-6249


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