So if it is not bonded at all, isn't that 100% dielectric reduction?
Chris

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Francis Byle
Sent: Tuesday, September 01, 2009 1:27 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] sodastrawing

Here's an image for discussion... The areas between the traces are not bonded at all. I'm not going to register my opinion, but am interested in the opinions of others on the acceptability of this flex. For background, it has a single layer of metallization, and uses an acrylic adhesive.

Regards,

Fritz Byle
Astronautics Corp.

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Monday, August 31, 2009 20:41
To: [log in to unmask]
Subject: [IPC-600-6012] sodastrawing

Hi all,

A customer has ask me to query the group about coverlayer sodastrawing.

From the applicable paragraphs in 6013 and 600, one could interpret sodastrawing as completely unacceptable unless it is a "nonlamination" , in which case it can reduce dielectric spacing by 25%.
Unfortunately there appears to be a disagreement about whether sodastrawing is to be included as a nonlamination.

Thanks,
Chris