IPC-600-6012 Archives

December 2011

IPC-600-6012@IPC.ORG

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Subject:
From:
Mike Hill <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Thu, 15 Dec 2011 08:32:42 -0600
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Joey,

Excellent question that comes up more and more as designers move conductors near the edge of boards and holes.  Certainly from a pure IPC-6012 perspective, the part you show violates the haloing criteria.

1. I have measured a lot of haloing and determined that the capability in the "industry" is about 10-12 mils of haloing for polyimide and about 8 mils for fr4. That includes new bits and everything else to eliminate the condition.

2. That being said, polyimide designs where any conductor is closer that 22 mils from an internal or external vertical edge and 16 mils for Fr4 must be flagged in the front end for an AABUS agreement.

3. Going forward, all of us in the 6012 committee should consider some defaults when the conductors are "close to an edge" in the new revision we are working on now.


Mike Hill
Quality Manager
DDI Virginia

++++++++++

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A Rios
Sent: Thursday, December 15, 2011 12:09 AM
To: [log in to unmask]
Subject: [IPC-600-6012] haloing

wondering how others interpret the applicability of 6012c 3.3.1 (and its
6018 equivalent) with respect to haloing, for designs that have metal to the edge of a pwb, as shown below?? conductor to conductor spacing is highly compliant, distance from the solder feature to the first halo along the edge is less than 4 mils.


to me 3.3.1 has a context where metal is away from the board edge by design, unlike the attached image.....

Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896

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