IPC-600-6012 Archives

May 2006

IPC-600-6012@IPC.ORG

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Subject:
From:
Mike Hill <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Thu, 11 May 2006 08:27:54 -0400
Content-Type:
text/plain
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Do we have an IPC test method to cover the measurement of localized
flatness?  If not, do we need one?

Mike Hill

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]]On Behalf Of Montgomery,
Scott D
Sent: Wednesday, May 10, 2006 6:02 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] IPC-6012B Bow and Twist Requirements


I also concur that not all designs need to be tighten.

If there is a concern for bow and twist for a specific family of
components, we will define a localized flatness for those component
areas on the fab drawing. This has worked very well.  My recollection is
that less than 5% of our boards were scraped by the fabricator due to
out-of-spec flatness.


Thanks
Scott


-----Original Message-----
From: Mark Harvey [mailto:[log in to unmask]]
Sent: Wednesday, May 10, 2006 2:43 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] IPC-6012B Bow and Twist Requirements

Concur.

If a design requires a tighter tolerance than they should identify that
on the print or by spec.

Forcing all product to that will drive up cost for all.

True story some designs do need a tighter tolerance.
-----Original Message-----
From: Franklin D Asbell [mailto:[log in to unmask]]
Sent: Wednesday, May 10, 2006 1:15 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] IPC-6012B Bow and Twist Requirements

I don't believe tightening these requirements would benefit all
companies as a whole. The problems I've seen experienced are isolated to
specific designs, on specific equipment.

I would propose something more clarified in respect to customers (i.e.
assemblers) and suppliers reviewing designs more closely together.
Customer A may have equipment to handle a certain amount of warp (as
noted below) while Customer B may not, Customer B could then tighten
this specific tolerance to a certain supplier who might make adjustments
for a certain amount of additional processing or even yields.

A general tightening of bow/twist may cause acceptable product to be
scrapped that might otherwise be used if pre-fabrication including
fabrication requirements discussions were performed.

Franklin D Asbell

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of John Perry
Sent: Wednesday, May 10, 2006 2:49 PM
To: [log in to unmask]
Subject: [IPC-600-6012] IPC-6012B Bow and Twist Requirements

Colleagues,

IPC continues to receive queries from industry as to whether or not
there will be a tightening of the bow and twist requirements for printed
boards that are given in both IPC-2221A and IPC-6012B.

I would like the members of this forum to provide their feedback on
these requests.

There are currently two arenas where we are getting requests for
alteration to the requirements: BGA devices and screen printing
technology.

Regarding BGA technology, Don Dupriest of Lockheed Martin Missiles and
Fire Control provided a .ppt file at the IPCWorks 2005 meeting for these
groups where the recommendation for bow and twist acceptance for
isolated BGA areas is 0.50%.

This presentation file is available at
http://www.ipc.org/committeedetail.asp?Committee=D-33A

Within "Drafts", under the titled "PCB Bow and Twist - BGA Devices"

Regarding screen printing technology, we recently received the following
request:

We had a board that was slightly warped, make contact with and damage
the camera in one of our screen printers. Of course, when I measured the
bow and twist, it was well within acceptable limits for bow and twist.

My question is this: Are the bow and twist specifications tight enough?
For over 15 years, I have been "jumped on" by the line operators and
maintenance guys to fixed warped boards only to find that the boards are
usually not any where near the limits. Since I have worked for multiple
companies, I see that this is an industry wide dilemma. Board
manufacturers typically can hold bow and twist requirements, but
different SMA machines (especially screen printers) aren't able to run a
board that has bow or twist near but within the specification limits.
Should I be asking why machines built for the surface mount industry
can't run boards that meet industry specifications, or if the
specifications that once fit, are in need of revision?

Larry D. Roberts
Quality Engineer
Andrew Corporation

Thanks for taking the time to review and respond to these industry
requests.

Regards,

John Perry
Technical Project Manager
IPC
3000 Lakeside Drive # 309S
Bannockburn, IL 60015
[log in to unmask]
1-847-597-2818 (P)
1-847-615-7105 (F)
1-847-615-7100 (Main)

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