 
| Subject: | |
| From: | |
| Reply To: | (Combined Forum of D-33a and 7-31a Subcommittees) |
| Date: | Tue, 8 Dec 2009 07:47:00 -0500 |
| Content-Type: | multipart/mixed |
| Parts/Attachments: |
|
|
resending my question.....
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896
Jose A Rios/Endicott/EIT
12/03/2009 04:58 PM
To
"(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]>
cc
Subject
coupon design question
Question to the group, has to do with coupon design: In order to better
distribute resin fill on a tightly fitted board/coupon array within a
panel, do the following modifications to voltage layers on E & H coupons
violate any of the 2221 design rules?? I dont beleive so, but I'd like
some validation.
Refer to screenshots below (as generated, voltage plane as generated,
proposed voltage plane). Ignore the S & T coupons for purposes of this
discussion.
Thanks.
1: As Generated:
2:Voltage plane, as generated, black is copper
3: Proposed voltage plane, black is copper:
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896
|
|
|
