IPC-600-6012 Archives

February 2008

IPC-600-6012@IPC.ORG

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Subject:
From:
"Gordon, Robert (J.)" <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Mon, 4 Feb 2008 22:40:03 -0500
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text/plain
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John,

We use OSP surface finishes for applications requiring a single soldering
process.  Generally, these boards are either single sided, non-plated
through hole boards, single sided silver jumper boards and double sided,
plated through hole boards.  I would estimate that approximately 5% of our
boards are OSP coated.  Please do not remove it from tabel 3-2.

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of John Perry
Sent: Monday, February 04, 2008 3:53 PM
To: [log in to unmask]
Subject: [IPC-600-6012] Bare Copper as a Surface Finish


Colleagues,

 

Our IPC-6012B specification provides for bare copper as a final finish in
Table 3-2, Final Finish, Surface Plating and Coating Thickness Requirements.

 

The task group is evaluating whether or not this should be removed from
Table 3-2 in the future IPC-6012 Revision C.  Among the concerns with bare
copper are instances of single-sided via protection that provides for
entrapment of chemistries that attack the bare copper in the hole wall.

 

If there are those of you out there who use bare copper as a surface finish,
could you provide feedback to IPC as to how it is used in your applications?

 

Thanks in advance,

 

John Perry

Technical Project Manager

IPC

3000 Lakeside Drive # 309S

Bannockburn, IL 60015

[log in to unmask]

1-847-597-2818 (P)

1-847-615-7105 (F)

1-847-615-7100 (Main)

 

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