Greetings to All
Someone has suggested that there are criteria in 6012 that specifically
address "wedge" voids.
Specifically that the thin copper plating created by them can be 0.5 mil and
that negative
etchback of 3.0 mil can exist if wedge voids are present.

None of the above make sense to me and I am not aware of anything that we
are working on that
would result in the above.

Please clarify that there isn't something going on regarding changing 6012
to include these
two extremely questionable criteria for wedge voids.

Thanks
Susan Mansilla
Technical Director
Robisan Laboratory, Inc
6502 E 21st Street
Indianapolis, IN  46219
317-353-6249 phone
317-917-2379 fax
www.robisan.com