IPC-600-6012 Archives

February 2008

IPC-600-6012@IPC.ORG

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Subject:
From:
"Gandhi, Mahendra (Space Technology)" <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Tue, 5 Feb 2008 08:50:51 -0600
Content-Type:
text/plain
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text/plain (76 lines)
Gordon,
OSP is a surface finish.

Mahendra 

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Gordon,
Robert (J.)
Sent: Monday, February 04, 2008 7:40 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Bare Copper as a Surface Finish

John,

We use OSP surface finishes for applications requiring a single
soldering process.  Generally, these boards are either single sided,
non-plated through hole boards, single sided silver jumper boards and
double sided, plated through hole boards.  I would estimate that
approximately 5% of our boards are OSP coated.  Please do not remove it
from tabel 3-2.

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of John Perry
Sent: Monday, February 04, 2008 3:53 PM
To: [log in to unmask]
Subject: [IPC-600-6012] Bare Copper as a Surface Finish


Colleagues,

 

Our IPC-6012B specification provides for bare copper as a final finish
in Table 3-2, Final Finish, Surface Plating and Coating Thickness
Requirements.

 

The task group is evaluating whether or not this should be removed from
Table 3-2 in the future IPC-6012 Revision C.  Among the concerns with
bare copper are instances of single-sided via protection that provides
for entrapment of chemistries that attack the bare copper in the hole
wall.

 

If there are those of you out there who use bare copper as a surface
finish, could you provide feedback to IPC as to how it is used in your
applications?

 

Thanks in advance,

 

John Perry

Technical Project Manager

IPC

3000 Lakeside Drive # 309S

Bannockburn, IL 60015

[log in to unmask]

1-847-597-2818 (P)

1-847-615-7105 (F)

1-847-615-7100 (Main)

 

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