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Reply To: | (Combined Forum of D-33a and 7-31a Subcommittees) |
Date: | Sat, 28 Sep 2002 15:31:18 EDT |
Content-Type: | text/plain |
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Hi John,
>The second issue of embrittlement, however, many not be so much of an issue
>- some task group members have calculated that the percentage of gold in
>solder, in cases of 30 µin depositions, is less than 4% and that gold
embrittlement
>is not really a problem.
This calculation is technical nonsense, because (1) it assumes uniform
distribution of Au which is virtually never the case, (2) the 4% number is
not a hard-and-fast limit, but a very general guideline. Thus, gold
embrittlement cannot be dismissed based on ths argument.
Best regards,
Werner Engelmaier
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