Susan,
Sounds like someone is trying to read something into the specification to
justify some questionable product.  The only place I can see where they
might be getting the 3 mil negative etchback is from figure 3-6.  They may
be interpreting the horizontal etching on the top and bottom of the
conductor as a wedge void??  Are they then combining this with Table 3-2 for
buried vias allowing 0.5 mil minimum?  Anyway, I agree with you and I am not
aware of any changes in this direction.
Scott

----- Original Message -----
From: "Susan Mansilla" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 08, 2002 3:44 PM
Subject: [IPC-600-6012] Wedge Void Criteria


> Greetings to All
> Someone has suggested that there are criteria in 6012 that specifically
> address "wedge" voids.
> Specifically that the thin copper plating created by them can be 0.5 mil
and
> that negative
> etchback of 3.0 mil can exist if wedge voids are present.
>
> None of the above make sense to me and I am not aware of anything that we
> are working on that
> would result in the above.
>
> Please clarify that there isn't something going on regarding changing 6012
> to include these
> two extremely questionable criteria for wedge voids.
>
> Thanks
> Susan Mansilla
> Technical Director
> Robisan Laboratory, Inc
> 6502 E 21st Street
> Indianapolis, IN  46219
> 317-353-6249 phone
> 317-917-2379 fax
> www.robisan.com
>