IPC-600-6012 Archives

August 2006

IPC-600-6012@IPC.ORG
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Subject:
Re: Inspection of Solder Resist
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Thu, 3 Aug 2006 16:27:54 -0500
Content-Type:
text/plain
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text/plain (27 lines) 
The criterion in A-610 has to do with the effect of assembly processing on
the solder mask, the conditions post assembly are not typically a factor
post fabrication (pre-assembly).

Franklin


-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Knapp,
Clarence W.
Sent: Thursday, August 03, 2006 4:16 PM
To: [log in to unmask]
Subject: [IPC-600-6012] Inspection of Solder Resist

I just run into a problem between IPC-A-600 and IPC-A-610. In the IPC
600 Solder Resist cracking is not addressed with the waves and wrinkles
so it is not inspected for and generally ignored. However, IPC-A-610
states that crack of the resist is a rejection. The enclosed picture is
an example of the crack on bare board.
 <<DSCN2423.JPG>>

Clarence W Knapp
M&P Engineering
Ph 818 715 2478
Fx 818 719 7769
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