IPC-600-6012 Archives

November 2006

IPC-600-6012@IPC.ORG

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Mon, 20 Nov 2006 10:47:26 EST
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Hi Chris,
You do not say what kind of holes and what diameters you are talking about. 
You also do not tell what caused the 'voids,' [for vias that term is actually 
misapplied, whatever they are, they are not voids (unless you just mean 
'absence' of material)]—drilling defect, delamination, 'resin recession,' plating 
inclusion, etc. In 6013, Table 3-2 the requirements are given and  "6012 
disposition" should be accordingly.
However, the real question regardless of "6012 disposition" is whether or not 
these PCBs would be functionally reliable. And that of course totally depends 
on their functional use—consumer products no likely proble, 
atomotive/military/other sever operating environments even passing "6012" may not be 
sufficient.

Werner

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