Need clarification on the definition of Via Structures as is relates to
Microsection Requirements.  

 

3.6.1.5 Microsection Requirements

 

            ..... Evaluation of all applicable PTHs and vias, including
blind and buried, for all such structures found on the finished printed
board shall be inspected in the vertical cross section in accordance
with Table 4-3. ...

 

 If a board has 1-2 lasers and 1-2-3 stacked lasers is it correct to
have 2 coupons one as 1-2 and one as 2-3.  Both drill cycles and plating
cycles are represented but the 1-2-3 total via structure is not.   Seems
like the 1-2 and 2-3 only is bending the intent.  

 

 

Wendi

 


 
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