Thanks Chris - it was not found as a deficiency we reviewed parts
running and there were no designs containing unsupported holes whew!
Need to figure out how to close this gap in our system though.

 Do you know if there is a drive to clear up this requirement between
the base spec, IPC-2221 and TM-650?  

Denise J Chevalier
Amphenol Printed Circuits
Quality Engineer
Phone - 603-324-4530
Fax - 603-386-6442
 
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-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Chris
Mahanna
Sent: Friday, June 24, 2011 11:00 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Bond Strength Testing for Unsupported Holes

Denise,
If you have unsupported holes, you'll need to make an A coupon with
unsupported annular rings for test.

I going to assume you don't have unsupported holes, in which case, IF
you are not fearful of false positive nonconformance, you can run SMT
bond strength testing on the N coupon.  Of course, both the method and
coupon are "cancelled".
Word of advice:  be careful about agreeing to this.
Background:  Not that it is necessarily related to your audit, but I
would say there is MUCH increased interest in this subject due to
cratering.  But, you have to be very careful about using room temp bond
strength tests for conformance.  And it is a very marginal risk
mitigation for cratering.

I would fight the deficiency finding if I were you.

Chris

Chris Mahanna
Robisan Lab

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of John Perry
Sent: Friday, June 24, 2011 10:46 AM
To: [log in to unmask]
Subject: [IPC-600-6012] Bond Strength Testing for Unsupported Holes

Hello Everyone,

I am submitting this query on behalf of Denise Chevalier at Amphenol
Printed Circuits:

We are being audited on 6012, 6013, and 6018; part of the survey
requires unsupported hoes be tested for bond strength monthly - we send
in our A/B coupons but they never test for bond strength saying they are
not required which makes sense because the A/B coupon has plated through
holes.  Does the group have a suggested methodology for how they comply
to this testing while still conforming to the base spec and IPC-TM-650?

Denise

Denise J Chevalier
Amphenol Printed Circuits
Quality Engineer
Phone - 603-324-4530
Fax - 603-386-6442

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