Thanks for the invitation, but I will not be available for the AZ meetings.

Thanks,

W. Glenn Colescott
                                           
Team Leader for Electro-Mechanical parts
Delphi Delco Electronics Systems
One Corporate Center  -  Mail Station R117
P.O. Box 9005
Kokomo, IN 46904-9005
Phone;  (765)-451-1258   FAX;  (765)-451-9647
Email; [log in to unmask]


-----Original Message-----
From: John Perry [mailto:[log in to unmask]]
Sent: Friday, November 15, 2002 12:19 PM
To: [log in to unmask]
Subject: [IPC-600-6012] IPC Interim Meeting Work for Flex Sections of
IPC-A-600G


Colleagues,

IPC is looking to schedule a meeting date for the 7-31a IPC-A-600 Task Group at the Interim Meetings in Tempe, AZ between February 3rd and February 9, 2003.  The focus of this meeting will be to work on section 4 of the IPC-A-600 "G" Draft relating to Flexible Printed Circuits.

At this time there are meetings scheduled for flex committees from Wednesday through Friday, Feb 5-7 in the areas of materials, test methods and design.  I would like for those of you interested in working on this part of the IPC-A-600G to indicate which date would work best.  Current flex meetings are as follows:

Wednesday, February 5
8:00 - 3:00 D-13 Flex Materials
3:00 - 5:00 D-15 T-Peel Test

Thursday, February 6
8:00 - 5:00 D-15 Flex Test Methods

Friday, February 7
8:00 - 12:00 D-12 Flex Board Performance
1:00 - 3:00  D-11 Flex Board Design
3:00 - 5:00 D-12a UL Flex

I would also point out that there is an IPC "FLEX & CHIPS" IPC International Symposium on Flexible Circuits and Chip Scale Packaging that runs from Monday, Feb 10 through Wednesday, Feb 12, as this may have some weight in your decision for a meeting date.  The link to the IPC web page detailing this symposium is http://www.ipc.org/html/calendar.htm#feb03

Regards,

John Perry
Technical Projects Manager
IPC