IPC-600-6012 Archives

October 2003

IPC-600-6012@IPC.ORG

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Subject:
From:
Nick Koop <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Mon, 6 Oct 2003 10:20:33 -0500
Content-Type:
text/plain
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Don,

Issue 1:
At Minco, we would follow essentially the same path that Dennis Cantwell of PCI outlined.  We would re-section a pair of coupons.

Issue 2:
I'm not sure I understand exactly what you are asking.  The paragraph references you note are not in 6013,  perhaps they are 6012 paragraph numbers?  The table 4-3 in amendment 1 seems to cover the attributes you mention, and does allow either an A or B coupon.  Also, reference paragraph 3.7 of 6013 which allows select attributes to be evaluated in non-thermally stressed coupons.

Tx!

Nick Koop
Minco Products, Inc
763-586-2846

>>> [log in to unmask] 10/03/03 03:36PM >>>
Greetings,
I've been asked to post the following questions for discussion related to 6012/6013.  Our Quality Engineering group wanted to clarify the following.
We would like to know how others are interpreting Referee Testing per paragraph 4.2.2 of IPC-6012A1 and paragraph 4.2.1 of IPC-6013-1.
Both paragraphs read as follows:
ISSUE 1:
Two additional microsection sets from the same panel may be prepared and evaluated for microsection defects that are considered to be isolated or random in nature or caused by microsection preparation.  For acceptance, both referee sets must be defect free.
How many coupons (A, B, A/B) are required to be tested?  What is considered to be a set? Is a pair a set; therefore 4 coupons are needed?
ISSUE 2:
As a side issue, para 4.2 "Acceptance Testing" does not include Plating voids (para 3.6.2.2), Laminate cracks (para 3.6.2.4), and Smear removal (para 3.6.2.6).  Acceptance testing being the equivalent of the old Group A.  And after reading the spec again, it really appears to me that we only need to look at one coupon.  Table 4-3 says "A or B" for structural integrity properties after thermal stress.

Thanks for your consideration,



        C. D. (Don) Dupriest
        Lockheed Martin Missiles and Fire Control - Dallas
        Electronics Manufacturing Engineering
        SME - PWB/CCA Technology Development
        Ph. 972/603-7724 fax: 972/603-3548
        Email: [log in to unmask]

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