Joey,

3.3.1 was not crafted to control this design where the copper goes to the routed edge of the printed board. The purpose of this section is to control haloing from the routed edge to copper that does not go the board edge. When the metal goes to edge of the board, the designer null/voided 3.3.1. The paragraph needs to be discussed and further clarified.


Randy
 
Randy Reed, CQE
Reliability Lab
Viasystems Group Inc.
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503.992.4421-direct  l   503.545.0150-cell
 
Merry Christmas & Happy New Year

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A Rios
Sent: Wednesday, December 14, 2011 9:09 PM
To: [log in to unmask]
Subject: [IPC-600-6012] haloing

wondering how others interpret the applicability of 6012c 3.3.1 (and its
6018 equivalent) with respect to haloing, for designs that have metal to the edge of a pwb, as shown below?? conductor to conductor spacing is highly compliant, distance from the solder feature to the first halo along the edge is less than 4 mils.


to me 3.3.1 has a context where metal is away from the board edge by design, unlike the attached image.....
 
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896

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