IPC-600-6012 Archives

December 2011

IPC-600-6012@IPC.ORG
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Subject:
Re: Solder mask cure on SMDs
From:
Mike Hill <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Mon, 5 Dec 2011 09:20:51 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (45 lines) 
Chris,

Usually gummy is tape adhesive not mask.   It might even have blue tent from the mask.

Are you sure it's mask?

Mike Hill

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Monday, December 05, 2011 9:29 AM
To: [log in to unmask]
Subject: [IPC-600-6012] Solder mask cure on SMDs

Hello all,
A customer has 1.0mm BGA SMD lands with gummy mask and ~0.4% solderability skips when edge dip tested.
By skip, I mean all surrounding lands solder beautifully, while the subject land takes no solder at all.
By gummy, I mean that pushing with hypodermic needle yields piled-up mask, not chipping mask.  Away from the SMD area, we get chipping mask.

Finish is ENIG, mask is BLUE.

I'm looking for comments on root cause, and maybe how to cost effectively collect more evidence.

We've got bitten by the uncertainty of FTIR testing before.  Differential solubility in mask stripper?

Thanks a million,
Chris

Chris Mahanna
Robisan Laboratory Inc.
317-353-6249


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