IPC-600-6012 Archives

May 2014

IPC-600-6012@IPC.ORG

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Subject:
From:
"Hill, Mike" <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Fri, 30 May 2014 13:24:45 +0000
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Nodule height per IPC 06012:

I always use the value in Table 3-10 for max. Cap plating protrusion:  For example: 2 mil max for class  2 and 3.



Table 3-10 Cap Plating Requirements
                     Class 1             Class 2                 Class 3
Filled Via Protrusion
(Bump) -          Maximum AABUS         50 ìm [0.002 in]         50 ìm [0.002 in]


Mike Hill
Quality Manager
Viasystems North America Inc.
www.viasystems.com
SOLUTIONS BEYOND LIMITS
1200 Severn Way; Sterling, Virginia 20166
Tel:703-652-2226 Mbl: 703-943-7091
[log in to unmask]




-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Gary Roper
Sent: Thursday, May 29, 2014 9:47 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Plating nodules on SMT pads

Brad,
I thought it was defined but I agree it is not. I'm a IPC Master trainer for
610 and J001. If you don't mind me using your picture in class I'll ask what participants would do with them.


Have a great day,

Gary C. Roper, MA, CQA, MIT
President, Roper Resources, Inc.
Master IPC Trainer, Blackfox Training Institute, LLC www.roper-resources.com
cell: 214-505-6800



-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Brad Toone
Sent: Thursday, May 22, 2014 4:53 PM
To: [log in to unmask]
Subject: [IPC-600-6012] Plating nodules on SMT pads

I have a question regarding plating nodules on SMT pads.  Searching through IPC 600 and 6012, the only place I can find anything regarding acceptance criteria for nodules is when it is mentioned in reference to thru holes and in reference to wire bond pads.  

IPC 6012 talks about defects on in a surface pad but only mentions "Defects such as nicks, dents and pin holes" in section 3.5.4.2.1 Rectangular Surface Mount Lands.  These are all void type defects, no mention of nodules.  

Any input on acceptability criteria of nodules on SMT pads?  Should IPC address this?  How would it be defined?  

Historically, we have accepted nodules up to .002 in tall and if they are not in a BGA area or on fine pitch components that we feel would be a solder risk.  I just want to see what others are doing.  See the attached for an example, the nodules in this case are .0013 tall.

Thanks,
Brad Toone
L-3 Communications CSW 


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