OOPS!
While working on these specifications, many of the requirements were
copied from the Mil-specs that preceded the IPC-6011, 6012, & 6013.  The
requirements for surface peel strength (foil laminated printed wiring
boards) inadvertently did not get transferred over.  If we were to amend
6012, the appropriate paragraph to add would be para. A.3.7.4.7 from
MIL-PRF-55110F Appendix A (with appropriate modifications).  The peel
strengths would still be IAW IPC-4101 for the required values.

Dennis J. Cantwell
R & D Liaison
Printed Circuits, Inc.
1200 West 96th Street
Minneapolis, MN 55431-2699
952-888-7900
[log in to unmask]
 
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Thomas E.
Kemp
Sent: Wednesday, April 25, 2007 9:55 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] peel strength

What's going on with foil lamination? I received notice yesterday from
DSCC
that we are going to have to qualify our foil lamination process for the
next QPL! Thankfully, we have been using foil lamination on our
qualification samples for some time now, so we won't see any change. But
yes, to some extent we need to at least identify the minimum peel
strength
requirements of IPC-4101 and 4103 as being applicable to foil laminated
product in IPC-6012 and possibly IPC-6018 for composite builds. I
believe
the testing requirements should wait until we decide on the possibility
of
the IPC QPL program.

Tom Kemp
QA Manager
Rockwell Collins Printed Circuits
319-295-1619


 

             Susan Hott

             <[log in to unmask]

             M>
To 
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             IPC-600-6012
cc 
             <IPC-600-6012@ipc

             .org>
Subject 
                                       Re: [IPC-600-6012] peel strength

 

             04/25/2007 09:30

             AM

 

 

             Please respond to

             "(Combined Forum

               of D-33a and

                   7-31a

              Subcommittees)"

             <IPC-600-6012@IPC

                   .ORG>

 

 





It isn't in 6012 - the only rigid board spec it appears in is 6016.

Do we need to add it to IPC-6012 for next revision?

Susan

Susan Hott
President
Robisan Laboratory, Inc
6502 E 21st Street
Indianapolis, IN 46219

317-353-6249 phone
317-917-2379 fax

www.robisan.com



-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]]On Behalf Of Chris
Mahanna
Sent: Tuesday, April 24, 2007 3:48 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] peel strength


Mahendra,
Yep.  That's where I get the 1.05 N/mm (using the military rules for
which
number to use).  But, how is the requirement invoked -for foil lam
conformance- from 6012?  If at all?
Chris

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]]On Behalf Of Gandhi,
Mahendra (Space Technology)
Sent: Tuesday, April 24, 2007 3:27 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] peel strength


Chris,
You need to look up IPC 4101 for this type of properties.

Mahendra

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Chris
Mahanna
Sent: Tuesday, April 24, 2007 11:37 AM
To: [log in to unmask]
Subject: [IPC-600-6012] peel strength

Hi all,

I was recently ask to determine the conformance requirement for surface
peel strength on a commercialized military board (foil lamination
obviously).  Knowing that it was FR-4 I quickly replied 1.05 N/mm.  Then
I pulled up 6012 and searched for peel, with zero results.  ???  What's
up with that?

Thanks in advance,
Chris

Chris Mahanna
Quality Manager
Robisan Laboratory Inc.
6502 E 21st Street
Indianapolis, Indiana 46219
317.353.6249