Everyone,

 

   I seem to remember a discussion about Haloing of edges and non plated
holes at one of our recent meetings.   The requirement for the haloing
to be less than 50% the distance to nearest conductor works assuming the
design has a reasonable space from conductor to edge.  I looked in
IPC2221 but did not find a guideline for suggested minimum distance.  We
are seeing non-plated tolling holes with surface ground rings at <10mils
hole edge to copper.  Depending on the material and hole size it's
difficult to meet the 50% rule.  

 

   Is there a section in 2221 I can send the designers to so we can
avoid this type of issue?

 

Thanks,

Wendi Boger

 


 
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