IPC has partnered with the Electronics Industries Alliance and the U.S.
Environmental Protection Agency to evaluate the life cycle environmental
impact of lead-free solder as compared to tin-lead solder.  We will be
holding a free informational meeting during APEX on the morning of Wednesday
January 23rd in the San Diego Convention Center.  For information on APEX or
to register, visit our website at www.goapex.org or contact me for further
information.

Fern Abrams
Director of Environmental Policy
IPC - The Association Connecting Electronic Industries
1333 H Street NW, 11th Floor West
Washington, DC  20005
202-962-0460
fax 202-962-0464


BACKGROUND

The U.S. electronics industry is facing significant legislative and market
pressure  to phase-out the use of tin-lead solders and switch to lead-free
alternatives, and some in the electronics industry have decided to make this
switch.  Although there has been significant investment and study into the
technical aspects of lead-free solders, there has been little if any
investment and study into the their environmental aspects.  There is concern
that, before the industry make a full-fledged switch away from leaded
solders, that a comprehensive evaluation of the potential environmental
impacts of lead-free solder alternatives occur.   The Electronic Industries
Alliance (EIA) and the IPC – Association Connecting Electronic Industries
(IPC) are currently requesting member company commitments to fund a  joint
Industry - United States Environmental Protection Agency project that would
assess the life-cycle environmental impacts of leaded and lead-free solders.
This project would be conducted under the agency’s Design for Environment
(DfE) program and would be non-regulatory in nature.  The purpose of the
project would be to ensure that the electronic industry has sufficient
information to select solders that pose the fewest risks and environmental
impacts over their life cycle.

POTENTIAL BENEFITS

Because many companies in the electronics industry have established a goal
of moving to lead-free solders within the next few years, it is essential to
know as soon as possible which options present the fewest risks to the
environment and public health.  It is also crucial to determine the
potential impacts of the most promising alternatives in order to determine
whether any of these solders may present significant risks or previously
unrecognized consequences so that exemptions from proposed bans, such as the
EU’s Restriction on Hazardous Substances Directive, can be secured. The use
of alternative solders will be a significant technological change for the
electronics industry, and the industry would like to be confident that
choices they make within the next few years will not later be found to pose
important, unexpected risks.  Finally, the industry supports comprehensive,
science-based studies that will help the industry promote its Design for the
Environment (DfE) efforts.  This study may become the model for future
agency action when it comes to promoting DfE efforts in the electronic
industry.

METHODOLOGY

Life-cycle assessment (LCA) is a process to evaluate the relative
environmental burdens and resource consumption associated with a product or
process.  The life-cycle stages evaluated in an LCA begin with raw material
extraction and extend through processing, manufacture, use, and end-of-life
disposition.

INDUSTRY COMMITMENT

The LCA study of tin-lead and lead-free alternative solders is expected to
take approximately three years to complete, with preliminary results
available after two years.  Participating companies will have the
opportunity to develop the exact scope of the study including selection of
solders to be evaluated, data components, priorities, and schedule.

FOR MORE INFORMATION

For more information, please contact EIA’s Director of Environmental
Programs, Holly Evans (703-9070-7576; [log in to unmask]) or IPC’s Director of
Environmental Policy, Fern Abrams (202-962-0460; [log in to unmask]).