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February 2012

EmbeddedNet@IPC.ORG

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Subject:
From:
Susan Filz <[log in to unmask]>
Reply To:
D-50 Embedded Devices Committee Forum <[log in to unmask]>, Susan Filz <[log in to unmask]>
Date:
Thu, 9 Feb 2012 14:07:48 +0000
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No problem .



Sent from my U.S. Cellular® Android-powered device





-----Original message-----

From: Dennis Fritz <[log in to unmask]>

To: EmbeddedNet <[log in to unmask]>, "[log in to unmask]" <[log in to unmask]>

Cc: Susan Filz <[log in to unmask]>

Sent: Wed, Feb 8, 2012 17:36:21 GMT+00:00

Subject: Re: [EM] Fwd: [EM] Fw: MILAERO007: What Became of the Embedded Passive Boom?



I cannot tell you all how pleasantly surprised I am that this single posting has generated so much interest. AND, from so many experts from around the world.



Susan, we may want to talk about updating this topic during IPC Expo.  Maybe it is not a strong US topic, but it seems to be very interesting around the world. In my absence at the Tuesday Suppliers Council meeting, please bring this up, and I will catch up Tuesday after 5 PM.



Denny





-----Original Message-----

From: Michael Weinhold <[log in to unmask]>

To: EmbeddedNet <[log in to unmask]>

Sent: Wed, Feb 8, 2012 5:16 am

Subject: [EM] Fwd: [EM] Fw: MILAERO007: What Became of the Embedded Passive Boom?





Begin forwarded message:



> From: Michael Weinhold <[log in to unmask]<mailto:[log in to unmask]>>

> Date: February 8, 2012 10:25:16 GMT+01:00

> To: D-50 Embedded Devices Committee Forum <[log in to unmask]<mailto:[log in to unmask]>>, "Viklund,

Per" <[log in to unmask]<mailto:[log in to unmask]>>

> Cc: Michael Weinhold <[log in to unmask]<mailto:[log in to unmask]>>

> Subject: Re: [EM] Fw: MILAERO007: What Became of the Embedded Passive Boom?

>

> Dear Experts,

>

> During the EIPC Winter Conference in Prague, on Feb. 2 and 3, 2012, embedding

was a hot topic.

> The automotive industry sees an absolute need to meet the goals for improved

reliability, miniaturization and cost reduction.

> Standard active and passive devices are embedded. Europe and Japan are very

much in the driver seat for the embedding technology.

> Hofmann Leiterplatten in Germany filed a patent in 1996 and it was granted in

2004. See details in the paper published at the Electronic Circuit World

Convention in Taiwan in Nov. 2011

> AT&S has purchased the patent end of 2011.  This is an important step for a

proven approach into the embedding technology using PCB (organic) material.

> During the conference the keynote presenter explained the leading role Europe

in making the embedding technology more accepted at the leading automotive

design center around the world.

> The most comprehensive information on embedding and testing are coming from

Japan.

> Standard on Device Embedded Substrate

> Terminology Reliability Test/Design Guide

> -Edition 4.0-

> JPCA-EB01 (2011)

>

> The version in the second edition are supplied as a IEC standard Proposal for

embedding devices in PCB.  A copy of this can be ordered through the EIPC

kwestenbergeipc.org.  More details you will find on the Web:

http://campaign.r20.constantcontact.com/render?llr=yyotzndab&v=001dTY-NYldfV0MeV9dd7Dzv5NBjZJP8_mQbImLLAQXe-CLp2c1qFJ3pREwnLTBX7bMzl-wSnEsixsYc7JkIJ8fFFMc464jeq65N5Mvkb7Qn4g%3D

>

> See you in San Diego at APEX 2012

> Best regards

>

> Michael Weinhold

>

>

>

> On Feb 8, 2012, at 9:50 , Viklund, Per wrote:

>

>> Hi Lionel,

>> When you say the boom is still there, are you talking about enbedded

thin/thick-film resistors or embedded decoupling capacitance?

>> ...or both?

>>

>> /per viklund

>>

>>

>>

>> 8 feb 2012 kl. 03:15 skrev "Lionel Fullwood" <[log in to unmask]<mailto:[log in to unmask]>>:

>>

>>> HI ALl:

>>>

>>> This is from Lionel at WKK in Hong Kong.

>>>

>>> THE BOOM IS STILL THERE!   It is just that those involved are not openly

>>> discussing it, as there is a definite market advantage for smart users!

>>>

>>> Lionel.

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>> ______________________________________________________________________

>>

>

> Michael Weinhold

> EIPC Technical Director

> European Institute of Printed Circuits

> Bourgognestraat 16

> P.O.Box 2060

> NL-6201CD Maastricht

> Office Phone: +31 43 3440872;  Direct Phone: +49 2223 708639

> Fax: +31 43 3440873;  Direct Fax: +49 2223 700896

>

> E-Mail: [log in to unmask]<mailto:[log in to unmask]>

> Web: www.eipc.org<http://www.eipc.org/>

>

>

>

>

>

>

>

>



Michael Weinhold

EIPC Technical Director

European Institute of Printed Circuits

Bourgognestraat 16

P.O.Box 2060

NL-6201CD Maastricht

Office Phone: +31 43 3440872;  Direct Phone: +49 2223 708639

Fax: +31 43 3440873;  Direct Fax: +49 2223 700896



E-Mail: [log in to unmask]<mailto:[log in to unmask]>

Web: www.eipc.org<http://www.eipc.org/>



















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