Colleagues,

The IPC D-53 Embedded Devices Performance Subcommittee will meet on
Wednesday, September 13th from 1:30 pm - 5:00 pm in Room M110 of the
American Airlines Training and Conference Center as part of IPCWorks
2006.

In addition to reviewing the action items from the February 2006
meeting, the agenda for this meeting will include review of the
following aspects of the IPC-6017 working draft:

1) Discussion on 3.5.1.1 and 3.5.2 and their applicability to section
3.5

2) Areas of thermal stress testing for section 3.6.1

3) Solder Mask coverage over passive devices on board surface

4) Verbiage on capacitor electrical testing in conjunction with Test
Method 2.5.5.10

5) Discussion on Hi-Pot testing in 3.8.1.1

6) Review of IPC-9252 in comparison with 3.8.1.2

7) Develop verbiage on IR and M&IR sections

The latest draft copy of IPC-6017 and the minutes from the February 2006
meeting are available at:
http://www.ipc.org/committeedetail.asp?Committee=D-53

Regards,

John Perry
Technical Project Manager
IPC
3000 Lakeside Drive # 309S
Bannockburn, IL 60015
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1-847-597-2818 (P)
1-847-615-7105 (F)
1-847-615-7100 (Main)