Colleagues,

All four of the subcommittees within the IPC D-50 Embedded Device Committee will be meeting at IPC APEX-Expo 2008.  Listed below are date, time and room assignments at the Mandalay Bay Convention Center in Las Vegas, NV, as well as agenda items up for discussion at the four subcommittee meetings:

D-51 Embedded Device Design Subcommittee (IPC-2316, IPC-2227)
Tuesday, April 1st  10:00 am - 12:00 pm, Tradewinds A Room

Agenda:

1) Review published IPC-2316 design guide, and determine which items require design type input as shown in IPC-2221/2222

2) Develop a Table of Contents for IPC-2227

3) Establish core commitment group and develop a teleconference meeting schedule between APEX-Expo 2008 and the fall IPC Midwest 2008.


D-52 Embedded Device Materials Subcommittee (IPC-4811, IPC-4821)
Wednesday, April 2nd  8:00 am - 10:00 am, Shell Seekers B Room

Agenda: The IPC D- 52 Subcommittee will hear a presentation from Denny Fritz, MacDermid, and Rocky Hilburn, Ticer Technology, summarizing information on embedded active and passive components gleaned from Tech Search Conferences in Munich in November 2007 and Austin in February 2008 as well as from other sources.  The Subcommittee will then look at the implications of embedding these discrete components in the areas of board design, materials, board performance and testing, boarding them for communication to the other IPC D-50 Subcommittees.


D-53 Embedded Device Performance Subcommittee (IPC-6017)
Wednesday, April 2nd  10:15 am - 12:00 pm, Shell Seekers B Room

Material for this meeting is available in a zipped file, labeled "Material for IPC APEX-Expo 2008 Meeting", under the "Drafts" link at the D-53 subcommittee web page located at:  http://www.ipc.org/CommitteeDetail.aspx?Committee=D-53

Agenda:

1) Section 3.3, Visual Requirements.  The subcommittee needs to determine whether to adopt the inspection ranges given in Table 11-1 of the IPC-J-STD-001D for visual inspection of embedded passive attributes or to retain the existing inspection ranges in this section, taken from IPC-6012B.

2) Section 3.6, Structural Integrity.  The subcommittee needs to determine if they will be adopting the future redesign of the A/B-R coupon developed by the 1-10c task group or design their own coupon.

3) Section 3.10.2, Heat Dissipation.  Discussion on whether further material on the subject exists within the IPC-4811 material and IPC-2316 design standards for embedded devices and should therefore be referenced within IPC-6017.

4) Section 4, Quality Assurance Provisions.  Discuss possible expansion of Table 4-1 for acceptance testing frequency of embedded passive attributes and other references to the qualification, acceptance and conformance testing tables in IPC-6012, IPC-6013, and IPC-6018.

5) Review comments to any other sections of IPC-6017 in preparation for a Final Draft build.


D-54 Embedded Device Test Methods Subcommittee (Method 2.5.5.10 and Method 2.5.7.2)
Wednesday, April 2nd  1:30 pm - 3:00 pm, Shell Seekers B Room

Agenda:

1) Power Dissipation Rating of Resistance (PDR)
*         Test proposal for PDR that addresses specific characteristics of EPDs
*         Gould report on the power dissipation test procedure (Rocky Hilburn)
*         Two test vehicles containing embedded resistors for experimental verification have been provided by Jason Ferguson
*         Additional information regarding PDR will be gathered from the industry as appropriate.
*         Looking for volunteers and collaborators
*         The tentative completion date is June-September of 2008 (Jan Obrzut responsible)

2) Search for a co-chair of D-54 ( Robert Croswell of Motorola was co-chairing the D-54 until  2007).

Regards,

John Perry
Technical Project Manager
IPC
3000 Lakeside Drive # 309S
Bannockburn, IL 60015
[log in to unmask]
1-847-597-2818 (P)
1-847-615-7105 (F)
1-847-615-7100 (Main)
www.goipcshows.org