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May 2006

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Subject:
IPC 4th International Conference on Flexible Circuits and Chip Scale Packaging
From:
Tina Nerad <[log in to unmask]>
Reply To:
D-50 Embedded Devices Committee Forum <[log in to unmask]>, Tina Nerad <[log in to unmask]>
Date:
Thu, 18 May 2006 16:47:09 -0500
Content-Type:
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IPC is soliciting technical presentations and educational courses for
the 4th International Conference on Flexible Circuits and Chip Scale
Packaging (CSP) being held July 24-25, 2006 in Minneapolis, MN.  Please
visit   http://www.ipc.org/FlexnChips to submit an abstract or course
proposal.

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