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March 2006

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Subject:
From:
"Andresakis, John" <[log in to unmask]>
Reply To:
D-50 Embedded Devices Committee Forum <[log in to unmask]>, Andresakis, John
Date:
Thu, 9 Mar 2006 11:27:05 -0500
Content-Type:
text/plain
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text/plain (42 lines)
Tom,

I am traveling, but may be able to call in.

John

-----Original Message-----
From: Tom Newton [mailto:[log in to unmask]]
Sent: Thursday, March 09, 2006 11:22 AM
To: [log in to unmask]
Subject: [EM] D-54 Subcommittee Teleconference - Thursday, March 09, 2006

Colleagues:

Please plan to participate with our Subcommittee Co-Chairs, Jan Obrzut and
Robert Croswell in the D-54 Embedded Devices Test Methods Subcommittee
teleconference.

1. HiPot Test Method 2.5.7.2 strategy for publishing the final draft.
2. Prioritization of test methods development:
a) Reliability
b) TCC
c) Dielectric Withstanding Voltage / AC stress method
d) Dielectric thickness < 8 microns
e) Measurement needs beyond YR 2010
3. Updated and keep current the D54 web page

The specifics for this D-54 Subcommittee Teleconference:

Date: THURSDAY, March 9, 2006
Time: 3:00 - 4:00 pm CDT
Call-In #: 1-620-782-8200; PIN: 89542#

Thanks!

Tom Newton
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