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May 2004

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Subject:
Re: IPC EPUG Teleconference
From:
Ryusuke Yajima <[log in to unmask]>
Reply To:
D-37 Sub-Committee Forum <[log in to unmask]>, Ryusuke Yajima <[log in to unmask]>
Date:
Fri, 21 May 2004 14:21:38 +0900
Content-Type:
text/plain
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text/plain (39 lines) 
I am not able to attend the teleconference.

****************************************
Ryusuke Yajima
[log in to unmask]
*****************************************


-----Original Message-----
From: EmbeddedNet [mailto:[log in to unmask]] On Behalf Of Susan Filz
Sent: Friday, May 21, 2004 5:05 AM
To: [log in to unmask]
Subject: [EM] IPC EPUG Teleconference

Dear Colleagues:

The IPC Embedded Passives Users Group will be having a teleconference
Thursday, June 3 at 1:00 pm Central time. The call in number is
620-584-8200. The PIN is 1546.



Please join us for "Advantages of Thin Laminate Buried Capacitance
Constructions for High Speed PCB Applications," presented by Nick Biunno and
George Dudnikov of Sanmina SCI.



Please let me know if you have any questions, I can be reached at
[log in to unmask]



Thanks,

Susan Filz

Manager, IPC Industry Programs

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