EMBEDDEDNET Archives

September 2005

EmbeddedNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
John Perry <[log in to unmask]>
Reply To:
D-50 Embedded Devices Committee Forum <[log in to unmask]>, John Perry <[log in to unmask]>
Date:
Tue, 13 Sep 2005 10:03:29 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (45 lines)
Colleagues,

 

The Thursday, September 15th teleconference for the IPC D-51 Embedded
Devices Design Subcommittee has been postponed.  

 

We will next meet via teleconference on Thursday, October 20th at 4PM
Eastern, 1PM Pacific.  This teleconference will be just under a week
before the D-51 meeting at IPCWorks 2005.

 

We intend to have review material for Ceramic Thick Film materials, UL
comments and draft verbiage for inductors during the 10/20/05 conference
call.

 

Regards,

 

John Perry

Technical Project Manager

IPC

3000 Lakeside Drive # 309S

Bannockburn, IL 60015

[log in to unmask]

1-847-597-2818 (P)

1-847-615-7105 (F)

1-847-615-7100 (Main)

 

ATOM RSS1 RSS2