Gary,  Thanks for the input.  Sorry I could not stay for your Phoenix session.  In case EmbeddedNet members want to catch up on IPC 2227, is there any chance the notes from Phoenix are on the Committee Page of the IPC website?  A draft of what you are working on?

Finally, our audience may want to know about materials and performance related to embedded actives in boards.  Are there any loose ends on standards assignments that TAEC needs to take up?  Dave MacGregor, you may want to chime in here for the readers - other activities of the D-50 committees on embedded devices.  

Denny






-----Original Message-----
From: Gary Ferrari <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Jan 26, 2010 8:12 am
Subject: Re: [EM] JPCA standard on embedded components, included active silicon devices


Denny, 
 
The IPC-2227 Embedded Design Standard committee has already spent considerable time reviewing this document for inclusion in our design standard. At our recent meeting in Phoenix, we determined what items are appropriate, as written, and those items that need more design information. At this point we are seeking input for those items that we felt were lacking. We will be meeting at Apex on Thursday, April 8th, at 3:15pm. 
 
Regards, 
 
Gary Ferrari 
FTG Circuits 
Director, Technical Support 
860-350-9300 
 
On 1/25/2010 9:43 PM, Dennis Fritz wrote: 
> All - here is the JPCA spec on embedded devices inside circuit boards. 
> JPCA is submitting this document for international adoption to the 
> International Electrotechnical Commission (IEC) Committee 91 for 
> consideration and approval. 
> 
> I anticipate that there will be discussion of how the US and IPC will 
> handle active silicon inside the circuit board at the upcoming Apex 
> technical meetings. Please review this, as this is a new blend - circuit 
> boards and electronic components in the same spec. 
> 
> Denny 
> 
> 
> (See attached file: 3.1-090702(Shibata-Embedded)_JPCA EB01-2nd Ed.pdf)