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June 2007

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Subject:
From:
Ryusuke Yajima <[log in to unmask]>
Reply To:
D-50 Embedded Devices Committee Forum <[log in to unmask]>, Ryusuke Yajima <[log in to unmask]>
Date:
Wed, 13 Jun 2007 09:11:42 +0900
Content-Type:
text/plain
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text/plain (31 lines)
Toppan NEC Circuits Solutions exhibited the actual product (module for
mobile phone) with embedded  component (WLCSP). It is reported  that they
have already produced 1.5 million pieces for the mobile phone for Casio,
etc.

Ryusuke Yajima 

-----Original Message-----
From: EmbeddedNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
Sent: Wednesday, June 13, 2007 1:20 AM
To: [log in to unmask]
Subject: [EM] Fw: [EM] CMK Investment in embedded. I stopped at their JPCA
booth.

I stopped at the CMK booth at JPCA.  When I asked about this investment, 
the booth attendant was pretty vague (they did find an attendant who spoke 
English for me).  While some of my US contacts say this investment is 
already under way (either at their Japan or at their China facilities), 
the booth attendant would only say the technology is in "the develpment 
phase".  I have CMK literature from the show definitely showing embedded 
component technology. 

Denny
----- Forwarded by Dennis Fritz/MacDermid/MACDERMID/US on 06/12/2007 11:56 
AM -----


12.     CMK (Major PWB manufacturer in Japan) 5/24
Will invest 15 billion yens for next 3 years to establish the
manufacturing capabilities of embedded passive PWB.

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