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September 2005

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Subject:
Re: TELECONFERENCE - D-52 Embedded Component Materials Subcommittee
From:
Dennis Fritz <[log in to unmask]>
Reply To:
D-50 Embedded Devices Committee Forum <[log in to unmask]>, Dennis Fritz <[log in to unmask]>
Date:
Fri, 30 Sep 2005 00:28:01 -0400
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Sorry that I was at the SMTA show today and missed the call.  I looked up
the materials document and saw the no vote from Sanmina concerning the
patent issue on the use of laminate for capacitors.   Hope that got
resolved.  I saw the technical issues from Jan Obrzut, but expected that
those could get rephrased.

Hope the telecon went well.

Denny

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