Came across this today. Jan, are you reading our e mails?

 

Embedded Components Generate New Discussion

 

February 14, 2012            

                                

Embedded components-actives and passives-embedded in IC package
substrates are generating renewed interest.  TechSearch International's
recent Advanced Packaging Update provides an insight into the new
developments at a variety of companies and the driving forces for these
embedded devices.

The primary advantage of embedding active devices in a package substrate
is reduced package height, but thermal advantages have also been
reported.  Several companies, including FlipChip International/Fujikura,
Fujitsu Microelectronics, Shinko Electric, and STATS ChipPAC report that
their embedded substrates can be used to assemble package-on-package
(PoP) with a total package height of 1.0mm or less (including solder
balls), and that there is significant interest from mobile
manufacturers.  Embedding the die also improves robustness in mechanical
shock (drop test), and increases security by making the device more
tamper-proof.

Embedded passives, primarily capacitors, have different drivers, and are
used to improve decoupling and enable higher operating frequencies on
the processor.  There are two initial markets for this technology: the
high-end networking and communication devices, and the low-power mobile
application processors.  It appears that mobile processors will be the
first to use embedded capacitors in production.

TechSearch International's annual survey on substrate design rules
providing special coverage of substrate design rules from suppliers of
organic flip chip substrates, PBGAs, and laminate CSPs (FBGAs) worldwide
is highlighted.  The design rules include body size, core thickness, via
and pad diameter, minimum bump pitch supported, and substrate finish.
An economic outlook for the industry is provided with an update on the
flood recovery in Thailand. The report is 79 pages and a complimentary
set of PowerPoint slides is provided.

TechSearch International, Inc., founded in 1987, is market research firm
specializing in technology trends microelectronics packaging and
assembly.  Multi- and single-client services encompass technology
licensing, strategic planning, and market and technology analysis.
TechSearch International professionals have an extensive network of more
than 15,000 contacts in North America, Asia, and Europe.  For more
information, contact TechSearch at tel: 512-372-8887, fax: 512-372-8889,
or http//www.techsearchinc.com.

 

 

Matt Holzmann

President

 

www.christopherweb.com

714.979.7500

 


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