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March 2006

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Subject:
D-54 Subcommittee Teleconference - Thursday, March 09, 2006
From:
Tom Newton <[log in to unmask]>
Reply To:
D-50 Embedded Devices Committee Forum <[log in to unmask]>, Tom Newton <[log in to unmask]>
Date:
Thu, 9 Mar 2006 10:22:29 -0600
Content-Type:
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Colleagues:

Please plan to participate with our Subcommittee Co-Chairs, Jan Obrzut
and Robert Croswell in the D-54 Embedded Devices Test Methods
Subcommittee teleconference. 

1. HiPot Test Method 2.5.7.2 strategy for publishing the final draft.
2. Prioritization of test methods development:
a) Reliability 
b) TCC
c) Dielectric Withstanding Voltage / AC stress method
d) Dielectric thickness < 8 microns
e) Measurement needs beyond YR 2010
3. Updated and keep current the D54 web page
  
The specifics for this D-54 Subcommittee Teleconference:

Date: THURSDAY, March 9, 2006
Time: 3:00 - 4:00 pm CDT
Call-In #: 1-620-782-8200; PIN: 89542# 

Thanks!

Tom Newton

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